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MSFT

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NVDA

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TSM

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ORCL

170.46

+5.2%↑

AAPL

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-2.71%↓

MSFT

431.52

+0.2%↑

NVDA

116.71

-1.94%↓

TSM

169.09

-2.02%↓

ORCL

170.46

+5.2%↑

AAPL

216.39

-2.71%↓

MSFT

431.52

+0.2%↑

NVDA

116.71

-1.94%↓

TSM

169.09

-2.02%↓

ORCL

170.46

+5.2%↑

Search

Amkor Technology Inc

Open

Sector Technology

30.24 -1.31

Overview

Share price change

24h

Current

Min

29.51

Max

30.38

Key metrics

By Trading Economics

Income

8M

67M

Sales

90M

1.5B

P/E

Sector Avg

26.33

60.694

EPS

0.27

Profit margin

4.582

EBITDA

14M

247M

Recommendations

By TipRanks

Recommendations

Buy

12 Months Forecast

+43.05 upside

Dividends

By Dow Jones

Next Earnings

28 Oct 2024

Next Dividend date

23 Sept 2024

Next Ex Dividend date

2 Dec 2024

Market Stats

By TradingEconomics

Market Cap

61M

8.1B

Previous open

31.55

Previous close

30.24

News Sentiment

By Acuity

20%

80%

31 / 382 Technology

Technical Score

By Trading Central

Confidence

Bullish Evidence

Amkor Technology Inc Chart

Past performance is not a reliable indicator of future results.

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Peer Comparison

Price change

Amkor Technology Inc Forecast

Price Target

By TipRanks

43.05% upside

12 Months Forecast

Average 43.86 USD  43.05%

High 55 USD

Low 35 USD

Based on 8 Wall Street analysts offering 12 month price targets forAmkor Technology Inc - Dist in the last 3 months.

Rating Consensus

By TipRanks

Buy

8 ratings

5

Buy

2

Hold

1

Sell

Technical Score

By Trading Central

30.18 / 32.23Support & Resistance

Short Term

Bullish Evidence

Intermediate Term

Strong Bearish Evidence

Long Term

Strong Bearish Evidence

Sentiment

By Acuity

31 / 382 Technology

News Sentiment

Very Strong Bullish Evidence

Volatility

Below average

News Volume (RCV)

Below average

Financials

Selling and administration expenses

Operating expenses

Pre-tax profit

Sales

Cost of sales

Gross profit on sales

Interest expense on debt

EBITDA

Operating profit

$

About Amkor Technology Inc

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.