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AAPL

232.1

+0.15%↑

NVDA

137.06

+1.12%↑

MSFT

416.71

+0.17%↑

TSM

205.69

+9.79%↑

ORCL

175.53

+0.46%↑

AAPL

232.1

+0.15%↑

NVDA

137.06

+1.12%↑

MSFT

416.71

+0.17%↑

TSM

205.69

+9.79%↑

ORCL

175.53

+0.46%↑

AAPL

232.1

+0.15%↑

NVDA

137.06

+1.12%↑

MSFT

416.71

+0.17%↑

TSM

205.69

+9.79%↑

ORCL

175.53

+0.46%↑

AAPL

232.1

+0.15%↑

NVDA

137.06

+1.12%↑

MSFT

416.71

+0.17%↑

TSM

205.69

+9.79%↑

ORCL

175.53

+0.46%↑

Home・Listă Acțiuni・Amkor Technology Inc

Amkor Technology Inc

Deschisă

Sector Tehnologie

31.25 2.36

Cumpără Vinde

Rezumat

Modificarea prețului

24h

Curent

Minim

30.25

Maxim

31.55

Indicatori cheie
By Trading Economics
Venit	8M 67M
Vânzări	90M 1.5B
P/E Medie Sector	26.33 57.481
EPS	0.27
Marjă de profit	4.582
EBITDA	14M 247M

Recomandări
By TipRanks
Recomandări	Cumpărare
Prognoză pe 12 luni	+34.51 upside

Dividende
By Dow Jones
Următoarele câștiguri	28 oct. 2024
Data viitoare de dividende	24 dec. 2024
Următoarea dată ex-dividende	2 dec. 2024

Statistici piață
By TradingEconomics
Capitalizare de piață	187M 7.4B
Deschiderea anterioară	28.89
Închiderea anterioară	31.25

Sentimentul știrilor

By Acuity

25%

75%

71 / 384 Clasament în Technology

Scor tehnic

By Trading Central

Încredere

Very Strong Bullish Evidence

30.1536 / 31.08 Suport & Rezistență

Amkor Technology Inc Grafic

Performanțele din trecut nu reprezintă un indicator fiabil al rezultatelor viitoare.

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Câștiguri

Kinder Morgan Cites Lower Than Budgeted Commodity Prices and Start-Up Delays on RNG Facilities >KMI

16 oct. 2024, 20:11 UTC

Câștiguri

Kinder Morgan Expects Adj EBITDA to Be Up 5% and Adj EPS to Be Up 9% for FY Vs 2023 >KMI

16 oct. 2024, 20:11 UTC

Câștiguri

Kinder Morgan Now Expects to Be Below Budget on Adj EBITDA by About 2% and on Adj EPS by About 4% >KMI

16 oct. 2024, 20:10 UTC

Câștiguri

Kinder Morgan Expects to Declare Dividends of $1.15 Per Shr for 2024 >KMI

16 oct. 2024, 20:10 UTC

Câștiguri

Kinder Morgan Budgeted 2024 DCF of $5 B, or $2.26 Per Share >KMI

16 oct. 2024, 20:10 UTC

Câștiguri

Kinder Morgan Project Backlog at End of 3Q Was $5.1 B >KMI

16 oct. 2024, 20:07 UTC

Câștiguri

Kinder Morgan: Final Investment Decision Reached for Gulf Coast Express Pipeline Expansion >KMI

16 oct. 2024, 20:06 UTC

Câștiguri

CSX Corp: 4Q Volume Expected to Grow Modestly>CSX

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16 oct. 2024, 20:05 UTC

Câștiguri

Kinder Morgan 3Q Rev $3.7B >KMI

16 oct. 2024, 20:05 UTC

Câștiguri

Kinder Morgan 3Q Adj EPS 25c >KMI

16 oct. 2024, 20:05 UTC

Câștiguri

Kinder Morgan 3Q EPS 28c >KMI

16 oct. 2024, 20:05 UTC

Câștiguri

Kinder Morgan 3Q Net $625M >KMI

16 oct. 2024, 20:05 UTC

Câștiguri

Kinder Morgan Sees FY EPS $1.22 >KMI

16 oct. 2024, 20:05 UTC

Câștiguri

Kinder Morgan Sees FY Net $2.7B >KMI

Comparație

Modificare preț

Amkor Technology Inc Așteptări

Obiectiv de preț

By TipRanks

34.51% sus

Prognoză pe 12 luni

Medie 41 USD 34.51%

Maxim 45 USD

Minim 35 USD

În baza a 6 analiști de pe Wall Street care oferă obiective de preț pe 12 luni pentruAmkor Technology Inc - Dist în ultimele 3 luni.

Consens privind evaluarea

By TipRanks

Cumpărare

6 ratings

Cumpărare

Păstrare

Vânzare

Ținând cont de 6 analiști care au acordat evaluări ale acțiunilor Amkor Technology Inc - Dist în ultimele 3 luni.

Scor tehnic

By Trading Central

30.1536 / 31.08Suport & Rezistență

Recent bullish events outweigh bearish events.

All events are bearish.

Recent bearish events outweigh bullish events.

Sentiment

By Acuity

71 / 384 Clasament în Tehnologie

Date financiare

Cheltuieli de vânzare și administrare

Cheltuieli de exploatare

Profit pre-impozitare

Vânzări

Costul vânzărilor

Profit brut din vânzări

Cheltuieli cu dobânzile pe datorie

EBITDA

Profit operațional

Despre Amkor Technology Inc

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.