AAPL

216.74

+0.17%↑

MSFT

434.71

+0.75%↑

NVDA

115.43

-1.11%↓

TSM

167.36

-1.02%↓

ORCL

167.33

-1.84%↓

AAPL

216.74

+0.17%↑

MSFT

434.71

+0.75%↑

NVDA

115.43

-1.11%↓

TSM

167.36

-1.02%↓

ORCL

167.33

-1.84%↓

AAPL

216.74

+0.17%↑

MSFT

434.71

+0.75%↑

NVDA

115.43

-1.11%↓

TSM

167.36

-1.02%↓

ORCL

167.33

-1.84%↓

AAPL

216.74

+0.17%↑

MSFT

434.71

+0.75%↑

NVDA

115.43

-1.11%↓

TSM

167.36

-1.02%↓

ORCL

167.33

-1.84%↓

AAPL

216.74

+0.17%↑

MSFT

434.71

+0.75%↑

NVDA

115.43

-1.11%↓

TSM

167.36

-1.02%↓

ORCL

167.33

-1.84%↓

Начало・Списък с акции・Amkor Technology Inc

Amkor Technology Inc

Затворен

Сектор Технологични

30.64 0.96

Купи Продай

Преглед

Промяна на цената на акция

24 ч

Текуща

Минимум

30.27

Максимум

30.89

Ключови измерители
By Trading Economics
Приходи	8M 67M
Продажби	90M 1.5B
P/E Средно за сектора	26.33 58.902
EPS	0.27
Марж на печалбата	4.582
EBITDA	14M 247M

Препоръки
By TipRanks
Препоръки	Купи
12-месечна прогноза	+44.61 upside

Дивиденти
By Dow Jones
Следващи печалби	28.10.2024 г.
Следваща дата на дивидент	23.09.2024 г.
Следваща дата на екс-дивидент	2.12.2024 г.

Пазарни показатели
By TradingEconomics
Пазарна капитализация	-733M 7.4B
Предишно отваряне	29.68
Предишно затваряне	30.64

Настроения в новините

By Acuity

50%

144 / 382 Класиране в Technology

Техническа оценка

By Trading Central

Увереност

Bullish Evidence

30.18 / 30.66 Подкрепа & съпротива

Amkor Technology Inc Графика

Миналото представяне не гарантира бъдещи резултати.

Свързани новини

17.09.2024 г., 23:10 ч. UTC

Топ новини

Bank of Canada Welcomes 2% Inflation, Pivoting Focus to Growth

17.09.2024 г., 16:37 ч. UTC

Печалби

Correction to Walmart Headlines on Aug. 15

17.09.2024 г., 16:21 ч. UTC

Придобивния, сливания и поглъщания

Generali Agrees to Sale of Turkish Business

17.09.2024 г., 16:03 ч. UTC

Печалби

Correction to Estee Lauder Headline on Aug. 19

17.09.2024 г., 21:45 ч. UTC

Топ новини

UAW Clashes With Jeep Maker Stellantis Over Promised Factory Work -- WSJ

17.09.2024 г., 21:20 ч. UTC

Топ новини

Fed's 'Reverse Repo' Balance Fell to Lowest in Over 3 Years. Why It Matters. -- Barrons.com

17.09.2024 г., 20:50 ч. UTC

Пазарно говорене

Financial Services Roundup: Market Talk

17.09.2024 г., 20:50 ч. UTC

Пазарно говорене

Basic Materials Roundup: Market Talk

17.09.2024 г., 20:38 ч. UTC

Топ новини

The Stock Market Is Priced for Middling Returns No Matter What the Fed Does -- Barrons.com

17.09.2024 г., 20:24 ч. UTC

Топ новини

U.S. Stocks Pare Gains; Traders Betting on Big Fed Cut -- WSJ

17.09.2024 г., 20:05 ч. UTC

Топ новини

Meta Extends Ray-Ban Partnership; Zuckerberg Says Glasses 'Next Major Tech Platform' -- IBD

17.09.2024 г., 20:00 ч. UTC

Топ новини

JPMorgan in Talks With Apple to Take Over Credit Card From Goldman -- 2nd Update

17.09.2024 г., 19:33 ч. UTC

Пазарно говорене

U.S. Natural Gas Futures Settle Lower -- Market Talk

17.09.2024 г., 19:28 ч. UTC

Топ новини

U.S. Stocks Give Up Gains; Traders Still Betting on Big Fed Cut -- WSJ

17.09.2024 г., 19:10 ч. UTC

Топ новини

Forget the Fed. This is the Stock Market's Biggest Risk. -- Barrons.com

17.09.2024 г., 19:08 ч. UTC

Пазарно говорене

Oil Futures Rise on Renewed Middle East Tensions -- Market Talk

17.09.2024 г., 18:21 ч. UTC

Пазарно говорене

Gold Down As Investors Await Fed Decision -- Market Talk

17.09.2024 г., 18:06 ч. UTC

Пазарно говорене

Barrick CEO Argues Valuation Case as Company Targets Growth -- Market Talk

17.09.2024 г., 17:36 ч. UTC

Пазарно говорене

Steel Industry Challenges on Display Amid Warning from Nucor -- Market Talk

17.09.2024 г., 17:32 ч. UTC

Пазарно говорене

Oil Futures Press Higher On Lebanon, Fed Watch -- Market Talk

17.09.2024 г., 17:07 ч. UTC

Пазарно говорене

Canada Housing Construction To Remain Weak Through 2024 -- Market Talk

17.09.2024 г., 17:04 ч. UTC

Придобивния, сливания и поглъщания

Workday Is Buying Evisort in Move Into AI-Based Document Intelligence -- Barrons.com

17.09.2024 г., 17:03 ч. UTC

Топ новини

JPMorgan in Talks With Apple to Take Over Credit Card From Goldman -- Update

17.09.2024 г., 16:43 ч. UTC

Пазарно говорене

Treasury Yields Rise As U.S. Indicators Show Strength -- Market Talk

17.09.2024 г., 16:20 ч. UTC

Пазарно говорене

Financial Services Roundup: Market Talk

17.09.2024 г., 16:11 ч. UTC

Топ новини

JPMorgan in Talks With Apple to Take Over Credit Card From Goldman -- WSJ

17.09.2024 г., 16:04 ч. UTC

Топ новини

U.S. Stock Indexes Rise; Traders Still Betting on Big Fed Cut -- WSJ

17.09.2024 г., 15:57 ч. UTC

Пазарно говорене

Bank of Canada 'Completely Behind the Curve' -- Market Talk

17.09.2024 г., 15:50 ч. UTC

Пазарно говорене

Global Forex and Fixed Income Roundup: Market Talk

17.09.2024 г., 15:50 ч. UTC

Пазарно говорене

Hitting 2% Inflation Not Enough to Justify Faster, Deeper Canada Rate Cuts -- Market Talk

Сравнение с други в отрасъла

Ценова промяна

Amkor Technology Inc Прогноза

Ценова цел

By TipRanks

44.61% нагоре

12-месечна прогноза

Среден 43.86 USD 44.61%

Висок 55 USD

Нисък 35 USD

Според 8 анализатори от Wall Street, предложили 12-месечна ценова цел за Amkor Technology Inc през последните три месеца.

Консенсусна оценка

By TipRanks

Купи

8 ratings

Купи

Задържане

Продай

Според 8 анализатори, дали борсови рейтинги на Amkor Technology Inc през последните 3 месеца.

Техническа оценка

By Trading Central

30.18 / 30.66Подкрепа & съпротива

Recent bullish events outweigh bearish events.

All events are bearish.

Recent bearish events outweigh bullish events.

Настроение

By Acuity

144 / 382 Класиране в Технологични

Финанси

Продажбени и админисративни разходи

Оперативни разходи

Печалба преди облагане с данъци

Продажби

Разходи за продажби

Брутна печалба от продажби

Разходи за лихви по дълг

EBITDA

Оперативна печалба

Относно Amkor Technology Inc

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.